JOB PREREQUISITE / QUALIFICATION PROFILE

The job responsibilities are:

1. Develop, maintain and update the Die attach, wire bond, gel fill, plasma clean process documentations such as Control Plan, FMEA, Work Instruction, golden sample.
2. Define machine requirements, capability and buy-off.
3. Troubleshooting problems associated with manufacturing processes.
4. Perform detail process and equipment analysis in order to perform a process capability, capacity, and failures analysis.
5. Design control systems to minimize costs and production issues.
6. Monitoring and control the process performance throughout production.
7. Initiate and lead the yield improvement activities.
8. Monitoring and review of production performance including Delivery performance, Quality level and Productivity on a continuous basis.

EDUCATION, QUALIFICATION

Degree / Diploma in Engineering.

EXPERIENCES

Minimum 3 years’ experience in electronic component manufacturing environment.

Must have worked in factory with automotive quality standards.

KNOWLEDGE

Die attach process and machine (Datacon/Esec/ASM).

Aluminum wire bonding process and machine (Delvotec/ASM/KNS).

Gell fill and encapsulation process and machine.

Plasma cleaning machine.

Lean Six Sigma.

Mechanical & electrical drawing.

Integrated management system (EMS, QMS, OHAS)

Core tools:

APQP (Advanced Product Quality Planning)

FMEA (Design and Process)

PPAP (Production Part Approval Process)

SPC

MSA

Minitab/related software for analysis.

ERP system (SAP).

8-D approach.

Total productive maintenance.

PERSONALITY REQUIREMENTS

Excellent leadership skills and a desire to work in a multinational team environment.

Able to communicate well in English (spoken and written).

Critical thinking.

Attention to detail.